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| 25 June 2008 |
Ref.: C001 |
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Dear Members & Exhibitors,
| CALL FOR PARTICIPATION |
International Technical Conference
2008.12.3-4
Shenzhen Convention and Exhibition Center,
China
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Hong Kong Printed Circuit Association and IPC will again bring you the largest trade show of its kind in Southern China -- the 2008 International Printed Circuit & Electronics Assembly Fair held in December 3-5, 2008 at the Shenzhen Convention and Exhibition Center, China.
The HKPCA & IPC Show will attract over 37,000 attendees to the exhibition with the technical conference expected to attract nearly 200 technology leaders.
Participating in the technical conference for this premier event is a great way for you and your company to gain global visibility in the electronic interconnection industry. An estimated 70% of all printed circuit boards manufactured in China are manufactured in the Southern China Region and as a result, customers and knowledge leaders will attend the HKPCA/IPC event.
The International Technical Conferences are highly regarded throughout the world for their depth, breadth and non-commercialism. Selection is highly competitive and reflects well on a company’s technical capabilities. Presenters will find an excellent and receptive audience at this event.
Present a Technical Paper:
Papers are sought on printed circuit board materials, printed circuit board processing, and end markets. The theme of the technical conference is Keys to PCB Manufacturers Success: Market, Materials and Processing. The following is a list of suggested technical paper topics:
| Key topic areas: |
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Lead Free Reliability |
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Surface Finishes |
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High Temperature Laminate |
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Cost Effective uVia |
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Embedded Passives |
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Performance, Quality and Reliability |
| Other Topics: |
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Design |
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Electromigration & Tin Whiskers |
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Environmental Concerns |
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High Speed, High Frequency & Signal Integrity |
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PCB Fabrication |
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Performance, Quality & Reliability |
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RFID Circuitry |
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Test, Inspection & AOI |
| > |
Flexible Circuits |
Requirements
Submit an abstract of approximately 300 words that summarizes work covering case histories, research and discoveries. Since the selection process is competitive, sufficient detail should be included in the abstract to allow the Technical Program Committee to assess the technical content of the proposed paper. The paper should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Oral presentations will be limited to 30 minutes including 5 minutes for attendee questions.
Organize a Session
Individuals interested in organizing a cohesive technical session, a panel discussion or forum, (requires recruiting three to four speakers from different companies), should submit a proposed topic and tentative paper titles and speaker names.
If you are interested in presenting a technical paper or organizing a session, please submit an abstract or session description with a brief biography and full contact information according to the following timeline.
Paper and session due dates
| Abstracts |
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July 18, 2008 |
| Acceptance |
...................................... |
August 4, 2008 |
| Manuscripts |
...................................... |
August 22, 2008 |
For submission of a paper
If you are interested in presenting a technical paper or organizing a session, please submit an abstract or session description with a brief biography and full contact information to:
Ms. Yommi Ma (China)
Tel: 86-20-37619007 ext:804
Fax: 86-20-37619011
Email: Yommi.ma@e21magicmedia.com.cn
Mr. Anthony Hilvers, IPC Vice President of Industry Programs (U.S.)
Fax: 1-847-615-7105
Email: anthonyhilvers@ipc.org
To Exhibit in the Event
If you are interested in exhibiting in the event, please contact:
Ms. Cathina Huen (Hong Kong)
Tel: 852-2185 7195
Email: cathina.huen@e21mm.com
Ms. Kathy He (China)
Tel: (86-20) 3761-9007 Ext 812
Email: kathy.he@e21mm.com
Mr. Anthony Hilvers (U.S.)
Fax: 1-847-615-7105
Email: anthonyhilvers@ipc.org |
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