Challenges of Power Integrity Design for High Performance ICT Products
Luo Zipeng - Senior Technical Expert of Huawei Technology Co., Ltd.
S-parameter Processing and Advanced Embedded Technology in High-speed PCB Design
Dr.Dai Wengliang - Founder of Xpeedic Technology Co., Ltd.
Discussion for Blowing Hole Phenomenon, Plate Selection and Drilling Conditions
Leo Huang - QA Director of APCB Electronics (Kunshan) Co., Ltd.
Manufacturability Design for High-speed PCB Signal Integrity
Dr. Wang Hongfei - Product Manager of ITEQ Corporation
PCB Design Standardization
Huang Wenqiang – GM of Mingrishuidi Co., Ltd.
Analysis and Simulation for Key Technical Points in the 5th IPC PCB Design Competition
Lu Yongli - Technical Directior of Shenzhen Hampoo Electronic Technology Development Co., Ltd.
Efficiency and Quality Assurance for System Level High-speed PCB Design
Lifang - Product Lead Engineer of Cadence
Customer Service Platform Based on Big Data
Dr. Liuwei - CTO of Aosheng Technology Co., Ltd.
Gold Level Sponsor:
Silver Level Sponsor:
PCB is the key carrier of the physical realization in the hardware product development, the delivery design is the result of electrical, thermal, structural, manufacturability, cost, cycle and other aspects demand comprehensive that competing and influencing each other, any negligence and inconsiderate will lead to a decline in the competitiveness of products.
IPC PCB Designer Council China Branch take the aims to promote the level of the PCB design industry for their own responsibility. We encourage the PCB designers to communicate with each other for the subject of equipment, design tools and technologies and other related information, and promote the inheritance and sharing of relevant knowledge and skills, so contribute a force to enhance the level of the PCB design industry.
Huawei Technology Co., Ltd.
Xpeedic Technology Co., Ltd.
APCB Electronics (Kunshan) Co., Ltd.
: 7 December 2017 (Thursday)
: Chrysanthemum Hall, 5/F, Shenzhen Convention & Exhibition Center