2009.12.2 (Wed) Venue: Peony Hall, 5/F, Shenzhen Convention & Exhibition Center Keynote Session    09:30-10:30 Registration 10:30-10:50 The Market Trends for PCB Industry in Greater China Mr. H.W. Kong, Honorary Chairman, Hong Kong Printed Circuit Association 10:50-11:10 The Global Challenges of IT industry in 2010 Mr. Daniel Chan, President, Institute for Supply Management, Hong Kong 11:10-11:30 Break Marketing Track - Customer Perspective 11:45-12:30 The Trend and Opportunity of Computer Server PCB Mr. William Liang, Advisory Global Commodity Manager, IBM Procurement China Limited 12:30-13:15 China Mobile Devices Market: Key Dynamics To Watch in 2010 Ms. Kitty Fok, Vice President of Greater China Research & Asia Pacific End-User Research & Statistics, IDC Asia/Pacific Ltd. 13:15-14:30 Afternoon Break 14:30-15:15 Lenovo Low Halogen PCB Transition Overall Consideration and Challenge Mr. Tadashi Kosuga, Program Director, ECAT & POWER Procurement Engineering, Quality & Procurement Engineering, Global Supply Chain, Lenovo   15:15-16:00 Packaging and Board Assembly Technologies: An Overview Flextronics     2009.12.3 (Thu) Marketing Track – Trends & Strategy Analysis Venue: Peony Hall, 5/F, Shenzhen Convention & Exhibition Center 09:30-10:00 Registration 10:00-10:20 Global and Regional FX Outlook: The Impact of Zero US Rates Mr. Daniel Hui, FX Strategist, The Hongkong and Shanghai Banking Corporation Limited 10:20-10:40 Global Macro Economic Trend and The Challenge in China Business Environment in 2010 Ms. Pansy Yau, Deputy Chief Economist, Hong Kong Trade Development Council 10:40-11:25 The Market Trends for the PCB Industry in Southern China Mr. Eric Fung, Vice-Chairman, Hong Kong Printed Circuit Association 11:25-12:10 The Global PCB Market, Government Policies and Environmental Trends Mr. Anthony Hilvers, Vice President of Industry Programs, IPC - Association Connecting Electronics Industries 12:10-13:30 Afternoon Break 13:30-14:15 Chinese Printed Circuit Industry Status and Policies Mrs. Jean Zhang, Executive Vice President, China Printed Circuit Association   14:15-15:00 The Current Development of the Taiwan PCB Industry Ms. Lin Su-Chin, Market Analyst, Industrial Technology Research Institute - Industrial Economics and Knowledge Center, Taiwan 15:00-15:15 Break 15:15-16:00 The Changes of PCB Demography Dr. Hayao Nakahara, President, N.T. Information Ltd. 16:00-16:45 Opportunities Presented by New Technologies and their Commercialization Mr. Gene Weiner, President & CEO, Weiner & Associates, Inc.   2009.12.3 (Thu) Technical Track - Materials and Processing Venue: Chrysanthemum Hall, 5/F, Shenzhen Convention & Exhibition Center 09:30-10:00 Registration 10:00-10:45 Environmental Legislation Affecting PWB Metallization Chemistries Mr. Dennis Yee, Asia R&D Director: Interconnect Technologies, Dow Electronic Materials (Formerly Rohm and Haas Electronic Materials) 10:45-11:30 Pb-free PTH Connector Rework Process Optimization Mr. Chuan Xia, SMT Subject Matter Expert, Cisco Systems Ltd 11:30-12:15 The Importance of Micro via Diameter Development and the Difficulty of Production Mr. Chen Wen De, Manager, Manufacturing Department, Zhuhai Founder Technology Multilayer PCB Co., Ltd Fushan Branch 12:15-13:30 Afternoon Break 13:30-14:15 The Effect of Moisture in DICY Prepreg Materials and its Role in the Color Change of Oxide Alternative Coatings during Lamination Mr. John A. Marshall, MultiBond Applications Manager, MacDermid Inc. 14:15-15:00 A New System for Automatically Registering and Exposing Solder Mask (SM) Materials for PCB Manufacturing Mr. Lionel Fullwood, Technical Director, WKK Distribution Ltd. 15:00-15:15 Break 15:15-16:00 Manufacturing of HDI Products with Highest Reliability Mr. Stephen Kenny & Mr. Tafadzwa Magaya, Product Manager, Atotech GmbH 16:00-16:45 Organic Metal based Nanofinish Technology for Advanced Surface Finishes Dr. Bernhard Wessling, Global Director, ORMECON® Products, Cookson Electronics – Enthone   Remarks: 1. The above conference program is subject to change without prior notice. 2. Seats are limited. Paid Conference is opened to pre-registered attendees only. For the Free Conference, priority admission will be given to invitees. 3. Depending on speaker’s preference, the Conference will be conducted in English/ Mandarin/ Cantonese. 4. No simultaneous interpretation is available in all conference sessions.