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| On-Site Forum (Free Admission) |
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| Date |
Time |
Venue |
| 2 December 2009 (Wed) |
13:30 – 15:25 |
Hall 1, Shenzhen Convention & Exhibition Center |
| 3 December 2009 (Thu) |
09:45 – 16:30 |
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| Agenda |
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| 2 December 2009 (Wed) |
| 13:30 – 14:20 |
Navigation Mine-Sweeping Solution for PCB & PCBA Short
Mr. Spark Sun, Esamber Electronic Science Technology Co., Ltd. |
| 14:35 – 15:25 |
A New Choice of Reducing Cost by Energy Saving and Mitigation of Waste for PCB – Introduction of Micro-etching Circulation System
Mr. WeiHong Zhao, Shenzhen China Run Sun Technology Co., Ltd. |
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| 3 December 2009 (Thu) |
| 09:45 – 10:35 |
Next Generation Microvia Filling Process for HDI and Packaging
Mr. Marc Lin, Product Manager, Asia Interconnect Technologies, Dow Electronic Materials |
| 10:50 – 11:40 |
Advanced ENIG and ENEPIG Final Finish Technology
Mr. Simon Lee, Product Manager, Asia Interconnect Technologies, Dow Electronic Materials |
| 13:30 – 14:20 |
Z-TECH to Broaden the Selection of Lead-Free Compatible Laminate Materials
Dr. Frank Gong, The Dow Chemical Company (China) Co., Ltd. |
| 14:35 – 15:25 |
UV Application for Bath Purification, COD Reduction and Disinfection
Dr. Martin Sörensen, CEO, a.c.k. aqua concept GmbH, Karlsruhe |
| 15:40 – 16:30 |
Fujifilm Development Technology Announcement For Future Innovation and Digitalization on PCB Manufacturing
Mr. Yasufumi Morimoto, Senior Engineering Manager, Fuji Film Hong Kong Ltd. |
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