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| Call for Participation |
| International Technical Conference |
| Materials & Processing Track on 3 December 2009 |
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| Hong Kong Printed Circuit Association and IPC will produce the largest trade show of its kind in Southern China -- the 2009 International Printed Circuit & Electronics Assembly Fair to be held on 2- 4 December 2009 at the Shenzhen Convention and Exhibition Center, Shenzhen, China. |
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| The theme of the 2009 event is “Join Hands, Leap Ahead”. The HKPCA & IPC Show is expected to attract tens of thousands of visits with the Technical Conference expected to attract nearly 400 technology leaders. |
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| Participating in the Technical Conference for this premier event is a great way for you and your company to gain global visibility in the electronic interconnection industry without a significant investment. An estimated 70% of all printed circuit boards manufactured in China are manufactured in the Southern China Region and as a result, customers and industry leaders will attend the event. |
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| The International Technical Conference is highly regarded throughout the world for their depth, breadth and non-commercialism. Selection will be focused on company's technical capabilities and respective achievement. Presenters will find excellent and receptive audience at this event. |
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| Present a Technical Paper |
| Papers are sought on printed circuit board materials, printed circuit board processing and end markets. The theme of the event is “The Keys to the Success of the PCB Industry – Market, Technology and Collaboration”. Following is the suggested topic list of the technical paper: |
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| Key Topic Areas |
 Lead Free Reliability |
| Surface Finishes |
| High Temperature Laminate |
| Cost Effective Microvias |
| Embedded Passives |
| Low Halogen Materials & CAF |
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| Other Topics |
| Electromigration and Tin Whiskers |
| Environmental Concerns |
| High Speed, High Frequency and Signal Integrity |
| Printed Electronics |
| Test, Inspection and AOI |
| Flexible Circuits |
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| Requirements |
| Submit an abstract of approximately 300 words that summarizes work covering case histories, research and discoveries. Since the selection process is competitive, sufficient details should be included in the abstract to allow the Technical Program Committee to assess the technical content of the proposed paper. The paper should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Oral presentations will be limited to 45 minutes including 5 minutes for attendee questions. |
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| Organize a Session |
| Individuals interested in organizing a cohesive technical session, a panel discussion or forum, (requires recruiting three to four speakers from different companies), should submit a proposed topic and tentative paper titles and speaker names. |
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| Benefits |
| As a conference speaker/author/session chair. You will be entitled to have a copy of the Proceedings, a free one-day conference pass on the day of your presentation, discounted registration fees for the full conference and complimentary admission to the show. |
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| Important Dates for Paper/Session Submission |
| Abstracts Submission Due Date |
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July 10, 2009 |
| Acceptance Announcement |
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July 29, 2009 |
| Manuscripts Submission Due Date |
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August 28, 2009 |
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| For Submission of a Paper |
| If you are interested in presenting a technical paper or organizing a session, please submit an abstract or session description with a brief biography and full contact information to: |
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| Ms. Michelle Man, e21 MagicMedia (China & Hong Kong) |
| Tel: (852) 2960-1829 |
| Fax: (852) 2960-1830 |
| Email: michelle.man@e21mm.com |
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| Mr. Anthony Hilvers, IPC (U.S.) |
| Tel: (1-847) 615-5637 |
| Fax: (1-847) 615-7105 |
| Email: anthonyhilvers@ipc.org |
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| Enquiry |
| Event Manager – e21 MagicMedia |
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| Mainland China |
| Ms. Coco Lam |
| Tel:(86-20) 3761-6123 |
| Fax: (86-20) 3761-9011 |
| E-mail: coco.lam@e21mm.com |
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