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 The International Technical Conference at the 2009 International Printed Circuit & Electronics Assembly Fair (2-4 December 2009, Shenzhen) offers a rare opportunity to acquaint yourself with the anticipated needs of major downstream customers.
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| Divided into two tracks talking about marketing and technical updates, the International Technical Conference gives you all you need to know to position yourself for the market rebound. Pre-register now! |
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| How you will benefit from attending the Conference: |
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Learn more about the requirements and expectations of key electronics brands, including representatives from IBM, Lenovo and Flextronics, at the Marketing Track – Customer Perspective to assist you in meeting current and future market demands of the PCB market. |
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Through the Marketing Track – Trends & Strategy Analysis, gain more information on market trends and strategies from such leading industry experts as HSBC, Hong Kong Trade Development Council and more. |
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Through the Technical Track – Materials and Processing, acquire knowledge of the latest technological developments in the industry to improve your production expertise. |
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In line with the theme of this year's Fair – “Join Hands Leap Ahead” – expand your network of industry contacts, identify potential partners, and generate new business opportunities. |
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Since its debut in 2002, the International Printed Circuit & Electronics Assembly Fair has become the flagship PCB and EA trade show for sourcing and technology exchange in Southern China. Don't miss this golden opportunity to enhance your position in the industry by attending the Conference at this year's show. |
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Enquiry
Event Manager - e21 MagicMedia |
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Mainland China
Ms. Coco Lam
Tel: (86-20) 3761-6123
Fax: (86-20) 3761-9011
E-mail: coco.lam@e21mm.com |
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| http://www.hkpca-ipc-show.org |
